DEVELOPER AND CONTRACT MANUFACTURER OF MODERN MULTILAYER HYBRID
INTEGRATED CIRCUITS
Electronics developers are constantly receiving new challenges. The requirements for increasing the specific power, frequency range, operating temperatures and miniaturization are expanding. Classical devices built on the basis of fiberglass are gradually being replaced by modern products based on ceramics, which allows to meet the necessary requirements.
Focon LLC offers its customers competencies both in the field of R&D and contract manufacturing capabilities certified according to the ISO 9001:2015 system. The materials we use meet the RoHS/CE directives and allow us to work both with alumina and alumonitride ceramics.
Electronics developers are constantly receiving new challenges. The requirements for increasing the specific power, frequency range, operating temperatures and miniaturization are expanding. Classical devices built on the basis of fiberglass are gradually being replaced by modern products based on ceramics, which allows to meet the necessary requirements.
Focon LLC offers its customers competencies both in the field of R&D and contract manufacturing capabilities certified according to the ISO 9001:2015 system. The materials we use meet the RoHS/CE directives and allow us to work both with alumina and alumonitride ceramics.
Key advantages:
• Creating multifunctional systems on a single substrate is our key competence.
• Individual approach to each customer
• Application of standard and individual design and technological solutions, reengineering
• One-sided and two-sided metallization, metallization of ends and through holes
• Multilevel wiring with high resolution and conductor density for modern tasks
• The thickness of the conductor after burning is 10 ... 200 microns
• High-precision resistors with low temperature coefficient of resistance
• The system of applied pastes is qualified for the temperature range -70 ... +200°C for highly reliable applications
• Fast production of test structures and prototypes
• Creating multifunctional systems on a single substrate is our key competence.
• Individual approach to each customer
• Application of standard and individual design and technological solutions, reengineering
• One-sided and two-sided metallization, metallization of ends and through holes
• Multilevel wiring with high resolution and conductor density for modern tasks
• The thickness of the conductor after burning is 10 ... 200 microns
• High-precision resistors with low temperature coefficient of resistance
• The system of applied pastes is qualified for the temperature range -70 ... +200°C for highly reliable applications
• Fast production of test structures and prototypes